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News

X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilities Following Licensing Agreement with X-Celeprint

ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips

Technical Presentation on Micro-Transfer Printing

Example Video of Micro-Transfer Printing Operation

Selected Publications on Micro-Transfer Printing

• A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology
• A new approach for a low cost CPV module design utilizing micro-transfer printing technology
• Active-Matrix OLED Display Backplanes Using Transfer-Printed Microscale Integrated Circuits
• Alignment-tolerant taper design for transfer printed III-V-on-Si devices
• AMOLED displays with transfer‐printed integrated circuits
• Automated micro-transfer printing with cantilevered stamps
• Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices
• Competing fracture in kinetically controlled transfer printing
• Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing
• Elastomer surfaces with directionally dependent adhesion strength and their use in transfer printing with continuous roll-to-roll applications
• Emissive displays with transfer-printed assemblies of 8um x 15um inorganic light-emitting diodes
• Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing
• Fan-Out Packaging of Microdevices Assembled Using Micro-Transfer Printing
• Five-junction photovoltaic cell has 44.5% efficiency
• Flexible and Scalable Heterogeneous Integration of GaN HEMTs on Si-CMOS by Micro-Transfer-Printing
• GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies
• GaSb‐Based Solar Cells for Full Solar Spectrum Energy Harvesting
• Heterogeneous Compound Semiconductor Integration
• Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing
• Heterogeneous Integration of Microscale Gallium Nitride Transistors by Micro-Transfer-Printing
• Heterogeneously integrated optoelectronic devices enabled by micro-transfer printing
• High accuracy transfer printing of single mode membrane silicon photonic devices
• High-Brightness Displays Made with Micro-Transfer Printed Flip-Chip microLEDs
• High-brightness displays made with micro-transfer printed flip-chip microLEDs
• Hybrid integration of an evanescently coupled AlGaAs microdisk resonator with a silicon waveguide by nanoscale accuracy transfer printing
• III-V-on-Si photonic integrated circuits realized using micro-transfer-printing
• Inorganic light‐emitting diode displays using micro‐transfer printing
• Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing
• Integration of GaN HEMTs onto Silicon CMOS by Micro Transfer Printing
• Integration of III-V light sources on a silicon photonics circuit by transfer printing
• Interface mechanics of adhesiveless microtransfer printing processes
• Interposing of Microelectronics by Micro Transfer Printing to Create 3-D Structures
• Kinetically controlled, adhesiveless transfer printing using microstructured stamps
• Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators
• Manufacturing Capability of Micro-Transfer Printing
• Micro-LEDs, a Manufacturability Perspective
• Micro-transfer printing for advanced scalable hybrid photonic integration
• Micro-transfer-Printed InGaAs/InP HBTs Utilizing a Vertical Metal Sub-Collector Contact
• Micro-transfer-printing and potential process optimizations by FEA
• Micro-transfer-printing of InP Photonic Devices to Silicon Photonics
• Novel adiabatic tapered couplers for active III-V/SOI devices fabricated through transfer printing
• On-chip optical interconnect on silicon by transfer printing
• Passive Matrix Displays with Transfer‐Printed Microscale Inorganic LEDs
• Pressure activated interconnection of micro transfer printed components
• Pressure-Activated Electrical Interconnection During Micro-Transfer-Printing
• Printing GaN HEMTs onto Silicon CMOS
• Printing-based assemble of quadruple-junction four-terminal microscale solar cells ad their use in high-efficiency modules
• Process Capability and Elastomer Stamp Lifetime in Micro Transfer Printing
• Scalability and Yield in Elastomer Stamp Micro-Transfer-Printing
• Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly
• Silicon photonics fiber-to-the-home transceiver array based on transfer-printing based integration of III-V photodetectors
• Stacked 5J Solar Cell Converts Nearly All Energy in Solar Spectrum
• Strategies for integration of lasers on silicon
• Thermal Analysis of InP Lasers Transfer Printed to Silicon Photonics Substrates
• Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode
• Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs
• Transfer print techniques for heterogeneous integration of photonic components
• Transfer printing by kinetic control of adhesion to an elastomeric stamp
• Transfer Printing for Silicon Photonics
• Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates
• Transfer printing of fully formed thin‐film microscale GaAs lasers on silicon with a thermally conductive interface material
• Transfer printing techniques for materials assembly and micro/nanodevice fabrication
• Transfer-printing for heterogeneous integration
• Transfer-printing-based integration of a III-V-on silicon distributed feedback laser
• Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters
• Transferred III-V materials-novel devices and integration
• Wafer-scale integration of group III–V lasers on silicon using transfer printing of epitaxial layers

Patent Portfolio and Licensing

With over 500 world-wide patents and patent applications, X-Celeprint has a broad and deep patent portfolio covering the fundamental technology of micro-transfer printing as well as applications of the technology. A recent analysis by Focus N.V. demonstrated the quality, value, and importance of the patents in our portfolio. The graph below is a comparison of the influence and importance of X-Celeprint’s patent portfolio compared to the U.S. average.