Selected Publications on Micro-Transfer Printing
- A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology
- A new approach for a low cost CPV module design utilizing micro-transfer printing technology
- Active-Matrix OLED Display Backplanes Using Transfer-Printed Microscale Integrated Circuits
- Alignment-tolerant taper design for transfer printed III-V-on-Si devices
- AMOLED displays with transfer‐printed integrated circuits
- Automated micro-transfer printing with cantilevered stamps
- Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices
- Competing fracture in kinetically controlled transfer printing
- Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing
- Elastomer surfaces with directionally dependent adhesion strength and their use in transfer printing with continuous roll-to-roll applications
- Emissive displays with transfer-printed assemblies of 8um x 15um inorganic light-emitting diodes
- Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing
- Fan-Out Packaging of Microdevices Assembled Using Micro-Transfer Printing
- Five-junction photovoltaic cell has 44.5% efficiency
- Flexible and Scalable Heterogeneous Integration of GaN HEMTs on Si-CMOS by Micro-Transfer-Printing
- GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies
- GaSb‐Based Solar Cells for Full Solar Spectrum Energy Harvesting
- Heterogeneous Compound Semiconductor Integration
- Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing
- Heterogeneous Integration of Microscale Gallium Nitride Transistors by Micro-Transfer-Printing
- Heterogeneously integrated optoelectronic devices enabled by micro-transfer printing
- High accuracy transfer printing of single mode membrane silicon photonic devices
- High-Brightness Displays Made with Micro-Transfer Printed Flip-Chip microLEDs
- High-brightness displays made with micro-transfer printed flip-chip microLEDs
- Hybrid integration of an evanescently coupled AlGaAs microdisk resonator with a silicon waveguide by nanoscale accuracy transfer printing
- III-V-on-Si photonic integrated circuits realized using micro-transfer-printing
- Inorganic light‐emitting diode displays using micro‐transfer printing
- Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing
- Integration of GaN HEMTs onto Silicon CMOS by Micro Transfer Printing
- Integration of III-V light sources on a silicon photonics circuit by transfer printing
- Interface mechanics of adhesiveless microtransfer printing processes
- Interposing of Microelectronics by Micro Transfer Printing to Create 3-D Structures
- Kinetically controlled, adhesiveless transfer printing using microstructured stamps
- Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators
- Manufacturing Capability of Micro-Transfer Printing
- Micro-LEDs, a Manufacturability Perspective
- Micro-transfer printing for advanced scalable hybrid photonic integration
- Micro-transfer-Printed InGaAs/InP HBTs Utilizing a Vertical Metal Sub-Collector Contact
- Micro-transfer-printing and potential process optimizations by FEA
- Micro-transfer-printing of InP Photonic Devices to Silicon Photonics
- Novel adiabatic tapered couplers for active III-V/SOI devices fabricated through transfer printing
- On-chip optical interconnect on silicon by transfer printing
- Passive Matrix Displays with Transfer‐Printed Microscale Inorganic LEDs
- Pressure activated interconnection of micro transfer printed components
- Pressure-Activated Electrical Interconnection During Micro-Transfer-Printing
- Printing GaN HEMTs onto Silicon CMOS
- Printing-based assemble of quadruple-junction four-terminal microscale solar cells ad their use in high-efficiency modules
- Process Capability and Elastomer Stamp Lifetime in Micro Transfer Printing
- Scalability and Yield in Elastomer Stamp Micro-Transfer-Printing
- Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly
- Silicon photonics fiber-to-the-home transceiver array based on transfer-printing based integration of III-V photodetectors
- Stacked 5J Solar Cell Converts Nearly All Energy in Solar Spectrum
- Strategies for integration of lasers on silicon
- Thermal Analysis of InP Lasers Transfer Printed to Silicon Photonics Substrates
- Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode
- Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs
- Transfer print techniques for heterogeneous integration of photonic components
- Transfer printing by kinetic control of adhesion to an elastomeric stamp
- Transfer Printing for Silicon Photonics
- Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates
- Transfer printing of fully formed thin‐film microscale GaAs lasers on silicon with a thermally conductive interface material
- Transfer printing techniques for materials assembly and micro/nanodevice fabrication
- Transfer-printing for heterogeneous integration
- Transfer-printing-based integration of a III-V-on silicon distributed feedback laser
- Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters
- Transferred III-V materials-novel devices and integration
- Wafer-scale integration of group III–V lasers on silicon using transfer printing of epitaxial layers
Patent Portfolio and Licensing
With over 500 world-wide patents and patent applications, X-Celeprint has a broad and deep patent portfolio covering the fundamental technology of micro-transfer printing as well as applications of the technology. A recent analysis by Focus N.V. demonstrated the quality, value, and importance of the patents in our portfolio. The graph below is a comparison of the influence and importance of X-Celeprint’s patent portfolio compared to the U.S. average.
