Micro-Transfer Printing Applications
Micro-Transfer Printing enables new levels of heterogenous integration, producing 3D ICs with significant performance benefits in a wide rage of areas:
Silicon Photonics
Micro-Transfer Printing can be used to build Photonic Integrated Circuits (PICs) with very efficient usage of valuable source materials, such as lasers, modulators, and detectors.

Benefits:
- Efficient assembly of multiple heterogeneous materials Lasers, Modulators, Detectors, Driver ICs: analog and logic
- Precision alignment at each step
Efficient coupling of devices to waveguide wafers - Mass Transfer
Scales to high device count as data demands continue to rise - Minimized device sizes
Significant savings of expensive III-V materials
RF 3D-ICs
Micro-Transfer Printing can tightly integrate III-V HEMTs and passives on CMOS for compact ultra-high-performance RF ICs

Benefits:
- Increase performance and power density Loosely packed x-chips on destination wafer improves thermal performance enabling larger HEMTs
- Reduced Cost Tightly packed x-chips on source wafer
Power 3D-ICs
Micro-Transfer Printing can tightly integrate power transistors – UFETs and LFETs from a wide variety of materials – onto a silicon CMOS driver IC.

Benefits:
- Increases switching frequency, density, transient response and system efficiency
Tight integration of power transistors, drivers and passives minimizes parasitics - Enables high-performance multi-stage, multi-phase hybrid topologies
Integration of multiple power transistors and drivers - Reduces cost
Resulting from higher integration and density
Bolt-on Root-of-Trust for Hardware Assurance and Security
Micro-Transfer Printing provides security and authentication functions for high-mix, low-volume semiconductor hardware assurance.

Benefits:
- DOD secure x-chip fabrication & printing
Post-processing allows for ‘bolt-on’ security for COTS parts - Provides hardware-based quantifiable assurance for cutting edge ICs produced in untrusted fabs
- μTP allows for dis-aggregated arrays of security x-chips. Further obfuscate functionality
- Bolt-on x-chips embedded in trusted facilities