X-Celeprint is a technology business that develops and licenses patented micro-transfer printing technology. X-Celeprint provides custom design services for micro-transfer-printing stamps and printers. Micro-transfer printing and engineering services are also available on request. To enquire about these services, please contact us at email@example.com.
It starts with devices on a source wafer, ready for retrieval. A transfer stamp selectively picks up a pre-defined array and puts it on the device substrate. Clean the stamp. Repeat. It’s the way to do mass transfer.
Bring together all the best semiconductor materials at micron-scales: III-V optoelectronics, CMOS, GaN, piezoelectrics, and more. X-Celeprint technology brings them together precisely aligned in a high-throughput massively parallel manner at room temperature.
Transparent silicone rubber: cast it on glass against a lithographically patterned mold and the result is a powerful vehicle for high-throughput micro assembly.
Mass-transfer, display architecture, defect management, and a can-do attitude. X-Celeprint has what you need. Work with us to define the future of displays.
Your bridge from wafer to panel: the elastomer stamp is the basis of X-Celeprint mass-transfer technology. Using simple materials that are naturally compliant, the stamp provides for a forgiving transfer process that easily scales to large arrays even on imperfect surfaces.
X-Celeprint builds micro transfer print equipment in small formats for table-top R&D use and in larger formats for semiconductor fabrication environments. Contact us to let us know what you’re looking for.
Problems with your LTPS? Can’t afford a mask set? Give us a call. Mass-transferred arrays of miniature Silicon CMOS chips can do what advanced TFT backplanes can do—and more—for a fraction of the start-up cost.
Integrate best in class material systems, with a proven assembly process, and construct some of the most efficient photovoltaics available.