Ennostar and X-Celeprint Join Forces to Advance Silicon Photonics Integration
Ennostar and X-Celeprint Join Forces to Advance Silicon Photonics Integration
Cork, Dublin, 25th September, 2025
Ennostar Inc. (TWSE: 3714), a global leader in optoelectronic semiconductors, is partnering with X-Celeprint Ltd, the European
pioneer in Micro-Transfer Printing (MTP) technology, to accelerate the adoption and commercialization of mass transfer
technology in silicon photonics. With proven expertise in high-volume optoelectronics manufacturing and mastery of micro-
scale devices such as Micro LEDs, Ennostar brings strong production capabilities to the partnership. X-Celeprint, recognized for
its global leadership in MTP for heterogenous integration, contributes cutting-edge technology that will enable efficient, scalable,
and production-ready silicon photonics solutions.
“Our focus is to drive innovation in AI optical interconnects, including solutions based on Micro LED, VCSEL, and CW-DFB LD
technologies,” said Patrick Fan, Chairman of Ennostar Corporation*. “By combining Ennostar’s advanced manufacturing know-
how with X-Celeprint’s world-leading MTP technology, we believe this collaboration will play a pivotal role in the silicon photonics
ecosystem. Through heterogeneous integration, we aim to unlock new breakthroughs in both performance and innovation for
the next generation of photonic devices.”
Peter Smyth, CEO at X-Celeprint, added, “By working with Ennostar, we are creating a seamless path for companies to accelerate
volume production of silicon photonics across multiple industries.”
Under the collaboration, X-Celeprint will provide its MTP technology and support its customers in qualifying their products for
MTP while Ennostar will act as a key manufacturing partner, supporting production. Both companies will jointly evaluate market
opportunities and strategically engage with third parties to drive the commercialization of advanced photonics solutions.
Ennostar noted that mass transfer technology, previously applied in Micro LED displays, has already reached a level of maturity.
With the rise of AI and high-performance computing, the demand for high-speed data transmission in data centers and advanced
computing systems is rapidly increasing, driving an urgent need in the optical communication industry for heterogeneous
integration and high-density packaging. Compared to traditional processes, MTP offers significantly greater efficiency and
precision, making it a key enabler to meet the challenges of next-generation industry upgrades.
“The introduction of MTP can increase transfer speeds by more than 30 times compared with conventional processes while
also improving transfer accuracy by 85%” said CN Huang, Vice President of Ennostar’s Advanced Research Center. This
represents a significant breakthrough in the integration of semiconductors and optoelectronic components for Co-Packaged
Optics (CPO). Looking ahead, Ennostar will continue to deepen its technology partnerships and expand market
About X-Celeprint
X-Celeprint is headquartered at the Tyndall Institute in Ireland leveraging Tyndall’s on-site cleanroom facilities and heterogenous integration research expertise. X-Celeprint’s R&D team leads MTP research and provides MTP customer industrialisation support and print services both at Tyndall and at the company’s North American HQ in North Carolina.